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Aug 28

Hynix claims the world’s fastest & smallest mobile DRAM chip

South Korea’s Hynix Semiconductor Inc., today announced that it has developed the world’s fastest and smallest 512Megabit mobile DRAM (dynamic random-access memory) that company claims operates at the world’s fastest speed of 200MHz.

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South Korea’s Hynix Semiconductor Inc., today announced that it has developed the world’s fastest and smallest 512Megabit mobile DRAM (dynamic random-access memory) that company claims operates at the world’s fastest speed of 200MHz.

Packed in a 8mm x 10mm package, the smallest size in industry, the chip is generated to meet the needs of third generation mobile phones which offer advanced services. “The product will deliver the memory capacity and speed required for third generation mobile phones that provide new services, such as DMB (Digital Media Broadcast), to subscribers,” Hynix, the world's second-largest computer memory chipmaker, said.

Hynix’s newly developed product meets the standards set by Joint Electron Device Engineering Councils (JEDEC), a semiconductor engineering standardization body of the trade association, called Electronic Industries Alliance (EIA), which represents all areas of the electronics industry.

The new 512 Megabit DRAM processes 1.6 Gbytes (400 bps x 32) of data per second through its 32bit wide I/O capacity. This processing speed is nearly 1.5 times faster than the speed of the companies existing mobile DRAM product.

Hynix says, “As the third generation of mobile phones has emerged, our 512Mb mobile DRAM is expected to offer higher capacity and faster speed solutions, which are required for advanced handsets such as DMB players and display phones.”

With improved speed and minimum size, the new product is expected to enhance the Company’s competitiveness in mobile industry, which is rapidly showing a trend miniaturization. In addition, the company plans to apply the new chip to the multi-chip package (MCP) which combines NAND flash memory and mobile DRAM, enabling manufacturers create slimmer mobile phones.

In order to fulfill customers’ demands for higher speed, larger capacity and lower power memory, Hynix will continue enhancing its development and marketing of mobile DRAM products. “We are almost at a final stage of receiving the world’s first validation from a major mobile chipset company,” Hynix said.

The Icheon, Korea based, Hynix Semiconductor Inc., the world’s top tier memory semiconductor supplier, has once again proved its technology leadership by launching the 512 Mb mobile DRAMS.

The company that offers DRAM chips and Flash memory chips to a wide range of established international customers, trades on the Korea Stock Exchange, and its Global Depository shares are listed on the Luxemburg Stock Exchange.

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