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VIA Technologies unveils VX700 chipset for Ultra Mobile PC

A Taiwanese manufacturer of integrated circuits, VIA Technologies has launched a new chip set, that will help reduce the size of ultra mobile PCs by as much as 40 %.

The Taipei, Taiwan based maker of motherboard chipsets, CPUs, and memory chips, VIA recently announced its VIA VX700 chipset for Ultra Mobile PC (UMPC) devices.

VIA said its VX700 chip set works with its own Via C7-M microprocessors aimed at small devices. The company said its recent solution, together with the C7-M/ULV processor, promises a smaller form factor for computing devices with reduced power consumption and enhanced functionality. The company said its UMPC solution could reduce mobile form factors size by up to 40% with low power and longer battery life.

Microsoft launched the ultra mobile PC concept earlier this year. Originally dubbed "Origami," the devices were designed to contain the power of a full PC in a gadget small enough to be carried in a pocket, purse or backpack.

This chip set is the pair of chips that regulate the flow of data from the microprocessor to other chips inside a device, such as memory and graphics chips.

In a statement, the company said that it slimmed down the size of its new VX700 chip set by integrating the north and south bridges of the set into a single package measuring 35 by 35 mm.

DualCor Technologies, which is based in Scotts Valley, California, said it adopted the VX700 chip set and C7-M microprocessor to create a new device that adds mobile phone functionality to an ultra mobile PC. The company declined to say when the device would be launched.

Key features of VX700 chipset

Item Detail
Processor Support VIA C7-M and VIA C7-M
ULV processors
Front Side Bus (FSB) 533/400MHz
Memory support DDR2-533/400/333 or
DDR-400/333
Memory density (max.) 4 GB
Graphics core VIA UniChrome Pro
Hardware Video Acceleration MPEG-2, MPEG-4, WMV9 HD
HDTV support Yes
LVDS/DVI transmitter Yes
Dual monitor support Yes
Video de-blocking Yes
Hardware display rotation Yes
High definition audio Yes
USB 2.0 connectivity 6 ports
PCI devices/slots 4 slots
Serial ATA 2 x SATA 150 devices or
2 x SATA II devices
IDE 1 EIDE channel up to 2
devices

The recent chip set, VIA VX700 is expected to be available in mass quantities later in the third quarter of 2006 and pricing is available upon request, the company stated.

VIA Technologies unveils VX700 chipset for Ultra Mobile PC
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